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The IoT Physical Layer
Design and Implementation
The IoT Physical Layer
Design and Implementation
Veröffentlicht 2018
von Ibrahim (Abe) M. Elfadel, Mohammed Ismail bei Springer International Publishing
ISBN: 978-3-319-93100-5
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Veröffentlicht 2019
von Michail Maniatakos, Ibrahim (Abe) M. Elfadel, Matteo Sonza Reorda, H. Fatih Ugurdag, José Monteiro, Ricardo Reis bei Springer International Publishing
ISBN: 978-3-030-15662-6
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Veröffentlicht 2016
von Ibrahim (Abe) M. Elfadel, Gerhard Fettweis bei Springer International Publishing
ISBN: 978-3-319-20481-9
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Veröffentlicht 2022
von Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel bei Springer International Publishing
ISBN: 978-3-030-95914-2
Machine Learning in VLSI Computer-Aided Design
Veröffentlicht 2019
von Ibrahim (Abe) M. Elfadel, Duane S. Boning, Xin Li bei Springer International Publishing
ISBN: 978-3-030-04666-8
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Veröffentlicht 2020
von Michail Maniatakos, Ibrahim (Abe) M. Elfadel, Matteo Sonza Reorda, H. Fatih Ugurdag, José Monteiro, Ricardo Reis bei Springer International Publishing
ISBN: 978-3-030-15665-7
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
Veröffentlicht 2019
von Ibrahim M. (Abe) Elfadel, Michail Maniatakos, Jose Monteiro, Ricardo Reis, Matteo Sonza Reorda, H. Fatih Ugurdag bei Springer International Publishing
ISBN: 978-3-030-15663-3
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Veröffentlicht 2022
von Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel bei Springer International Publishing
ISBN: 978-3-030-95913-5
The IoT Physical Layer
Design and Implementation
The IoT Physical Layer
Design and Implementation
Veröffentlicht 2018
von Ibrahim (Abe) M. Elfadel, Mohammed Ismail bei Springer International Publishing
ISBN: 978-3-319-93099-2
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Veröffentlicht 2018
von Ibrahim (Abe) M. Elfadel, Gerhard Fettweis bei Springer International Publishing
ISBN: 978-3-319-79305-4
Machine Learning in VLSI Computer-Aided Design
Veröffentlicht 2019
von Ibrahim (Abe) M. Elfadel, Duane S. Boning, Xin Li bei Springer International Publishing
ISBN: 978-3-030-04665-1
The IoT Physical Layer
Design and Implementation
The IoT Physical Layer
Design and Implementation
Veröffentlicht 2019
von Ibrahim (Abe) M. Elfadel, Mohammed Ismail bei Springer International Publishing
ISBN: 978-3-030-06588-1
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Veröffentlicht 2023
von Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel bei Springer International Publishing
ISBN: 978-3-030-95916-6
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Veröffentlicht 2016
von Ibrahim (Abe) M. Elfadel, Gerhard Fettweis bei Springer International Publishing
ISBN: 978-3-319-20480-2